DS4000 — 400G Open Bare-Metal Switch OEM / ODM Platform

1U open bare-metal 400G spine switch · 32×QSFP-DD 400GbE · Broadcom Tomahawk3 · 12.8 Tbps · available for OEM / ODM

Overview

DS4000 — 400G Open Bare-Metal Switch OEM / ODM Platform
DS4000 — 400G Open Bare-Metal Switch OEM / ODM Platform

Open 400G Spine Switch Platform

  • 32×QSFP-DD 400GbE, breakout to 4×100G / 2×200G
  • 12.8Tbps, 64MB buffer, <700ns latency
  • 1+1 redundant 1500W PSU, dual airflow
  • ONIE open architecture · SONiC/AsterNOS
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Overview

The DS4000 serves as our proven reference hardware platform for **OEM / ODM data-center switch projects**. Based on mature Broadcom Tomahawk3 silicon, this 1U open bare-metal 400G spine switch can be adapted to your brand and technical requirements. - 32×QSFP-DD 400GbE, breakout to 4×100G / 2×200G - 12.8Tbps, 64MB shared buffer, <700ns latency - 1+1 redundant 1500W PSU, dual airflow options - ONIE open architecture, compatible with SONiC / AsterNOS

Key Features

  • 1U rack-mount open bare-metal 400G data center switch, powered by Broadcom Tomahawk3 high-performance switching ASIC, designed for high-bandwidth spine-leaf CLOS architecture of cloud, big data and AI clusters.
  • 32 × QSFP-DD 400GbE high-density data ports; each port supports flexible breakout into 4×100G or 2×200G sub-rate ports to meet spine core, leaf TOR and aggregation layered networking demands.
  • Total switching capacity up to 12.8 Tbps with 64MB large shared packet buffer, ultra-low cut-through forwarding latency below 700ns, excellent burst absorption and congestion control for high-concurrency AI training and storage traffic.
  • Enterprise high-reliability hardware design: 1+1 redundant hot-swappable 1500W AC power supplies, redundant hot-swappable fan modules; dual airflow options (front-to-back / back-to-front) to match different cabinet cooling layouts.
  • High-performance Intel Xeon D x86 modular control plane, independent BMC out-of-band management chip, fully compliant with IPMI 2.0 for remote hardware monitoring, fault alarm and power on/off control.
  • Standard ONIE open installation architecture, natively compatible with mainstream open NOS including SONiC and AsterNOS, fully decoupled hardware & software to support customized data center network deployment.
  • Complete L2/L3 full-stack data center protocols: IPv4/IPv6 dual stack, static routing, OSPF, MP-BGP, IS-IS, VLAN, MC-LAG, IGMP Snooping, TRILL and VXLAN overlay virtual tunneling.
  • Full DCB lossless Ethernet capability: DCBX, PFC priority flow control, ETS enhanced transmission selection, QCN congestion notification, perfectly adapted to RDMA low-latency transmission for AI storage and computing clusters.
  • Multi-level refined QoS scheduling, two-rate three-color traffic policing, airtime fairness, DSCP mapping, effective traffic isolation and bandwidth guarantee for multi-tenant cloud scenarios.
  • Comprehensive network security defense: multi-layer ACL filtering, anti-DDoS attack, wireless frame filtering, port isolation, access control list to avoid cross-tenant data leakage.
  • Rich automated operation & maintenance capabilities: ZTP zero-touch automatic deployment, real-time high-precision telemetry, REST API, SSH, SNMP, CLI multi-mode management, easy integration with cloud native automation platforms.
  • Optional IEEE1588v2 & SyncE high-precision clock synchronization module to meet timing synchronization requirements of financial, 5G and high-performance computing scenarios.

OEM / ODM Customization Options Based on DS4000 Platform

We support multiple-level customization for B2B partners based on this bare-metal switch platform. - **White-Label Branding**: Custom front-panel silk-screen logo, custom model naming, customized packaging for your private-label product line. - **Hardware Adjustment**: Selectable memory / storage configuration; adjust auxiliary port combinations according to project requirements. - **Firmware & NOS adaptation**: Assist with SONiC configuration tuning, feature enable/disable, and specialized function tailoring. - **Documentation Customization**: Custom datasheet, user manual and quick-start guide printed under your brand identity. - **Project-oriented service**: Sample validation, small-batch trial production and mass-production delivery. > This platform is widely adopted by system integrators, solution vendors and IT distributors for building their own branded 400G data-center switch products.

Specifications

Basic Hardware & Switch Chip

Item Parameter
Model DS4000
Switch ASIC Broadcom Tomahawk3
Form Factor 19-inch standard 1U rack-mount chassis
Switching Bandwidth 12.8 Tbps
Packet Buffer 64MB shared packet buffer
Cut-through Latency <700ns port-to-port forwarding latency
Forwarding Table Capacity Large LPM routing table, multi-layer ACL entry storage, support large-scale cloud multi-tenant routing

Interface Specifications

Item Parameter
Data Ports 32 × QSFP-DD 400GbE high-density optical ports
Port Breakout Capability Each QSFP-DD port can split into 4×100G or 2×200G sub-rate ports
Auxiliary Management Ports 1 × RJ45 10/100/1000M shared CPU/BMC management Ethernet port; 1 × RJ45 RS232 serial Console debug port; 1 × Type-A USB 2.0 local storage port; Optional 1-2 × SFP+ 10G auxiliary optical ports

Control Plane & BMC OOB Management

Item Parameter
CPU Module COM-E modular Intel Xeon D x86 processor, 4-core standard configuration
Memory Standard 16GB ECC DDR4, expandable up to 32GB
Local Storage M.2 SSD (default 64GB)
BMC Management Independent BMC management chip, fully compliant with IPMI 2.0 standard; Support remote hardware health monitoring, fault alarm, remote power on/off control
Installation Architecture Standard ONIE open bare-metal installation system

Power, Cooling & Power Consumption

Item Parameter
Power Supply 1+1 redundant hot-swappable 1500W AC power modules
Input Voltage AC 100-240V auto-ranging, 47-63Hz
Cooling Fans 6+1 redundant hot-swappable fan modules
Airflow Options Dual airflow design, Front-to-Back (F2B) / Back-to-Front (B2F) optional
Peak Power Consumption 1100W (with full QSFP-DD 400G optical modules)

Physical Dimension & Environment

Item Parameter
Dimension H 43.1mm × W 438.5mm × D 657.5mm
Operating Temperature -5°C ~ +40°C (both airflow modes)
Storage Temperature -40℃ ~ +70℃
Operating Relative Humidity 40% ~ 60% RH, non-condensing
Storage Relative Humidity 5% ~ 95% RH, non-condensing
MTBF ≥150,000 hours

L2/L3 & Data Center Features

Category Features
L2/L3 Routing Protocols IPv4/IPv6 dual stack, static route, RIP, OSPF, IS-IS, MP-BGP, ECMP/WCMP, VRF, VRRP; VLAN, STP/RSTP/MSTP, MC-LAG, IGMP Snooping, PIM-SM/PIM-DM/PIM-SSM multicast
DCB Lossless Ethernet DCBX, PFC priority flow control, ETS enhanced transmission selection, QCN congestion notification; Support RDMA low-latency lossless transmission for AI computing & storage clusters
Overlay Virtual Network VXLAN overlay tunnel encapsulation/decapsulation, TRILL, NVGRE, L2 GRE, hardware-based tunneling
QoS & Traffic Management 10 independent QoS queues per port for unicast/multicast traffic; SP, WRR, WDRR multi-level scheduling, two-rate three-color traffic policing; Per-port DSCP mapping, airtime fairness scheduling, port-level bandwidth limitation
Security & Telemetry Multi-layer hardware ACL filtering, anti-DDoS attack defense, port isolation, storm control; Real-time high-precision telemetry, packet timestamp, buffer instantaneous traffic capture; Optional IEEE1588v2 & SyncE high-precision clock synchronization module

Management Methods

Category Items
Local Management CLI serial console, local WEB GUI
Remote Management SSH, SNMP v2c/v3, REST API, ZTP zero-touch automatic provisioning
Out-of-band Management BMC IPMI 2.0 remote power control, full hardware real-time health monitoring

Application Scenarios

  • Cloud data center high-performance Spine-Leaf CLOS architecture
  • AI computing / big-data / HPC cluster interconnection
  • 400G spine core deployment
  • High-capacity data center aggregation-layer networking
  • Reference hardware platform for OEM / ODM private-label switch product development

For OEM-ODM customization requirement, sample request or project quotation, please contact our solution team.

Request OEM / ODM Quote

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